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Thermoelectric Devices and Diamond Films for Temperature Control of High Density Electronic CircuitsThe increased speeds of integrated circuits is accompanied by increased power levels and the need to package the IC chips very close together.
Document ID
20060038005
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/33286
Authors
Vandersande, J.
Ewell, R.
Fleurial, J-P.
Lyon, H.
Date Acquired
August 23, 2013
Publication Date
August 30, 1994
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Other
Keywords
high power densities IC chips thermal management microcoolers thermal lenses
thermoelectric devices diamond films high density electronic circuits

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