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Record 1 of 43712
The Design and Implementation of NASA's Advanced Flight Computing Module
External Online Source: hdl:2014/33518
Author and Affiliation:
Alkakaj, Leon
Straedy, Richard
Jarvis, Bruce
Abstract: This paper describes a working flight computer Multichip Module developed jointly by JPL and TRW under their respective research programs in a collaborative fashion. The MCM is fabricated by nCHIP and is packaged within a 2 by 4 inch Al package from Coors. This flight computer module is one of three modules under development by NASA's Advanced Flight Computer (AFC) program. Further development of the Mass Memory and the programmable I/O MCM modules will follow. The three building block modules will then be stacked into a 3D MCM configuration. The mass and volume of the flight computer MCM achieved at 89 grams and 1.5 cubic inches respectively, represent a major enabling technology for future deep space as well as commercial remote sensing applications.
Publication Date: Mar 15, 1995
Document ID:
20060038136
(Acquired Sep 14, 2006)
Document Type: Preprint
Financial Sponsor: Jet Propulsion Lab., California Inst. of Tech.; Pasadena, CA, United States
Description: In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: Copyright
NASA Terms: AIRBORNE/SPACEBORNE COMPUTERS; CHIPS (ELECTRONICS); COMPUTER COMPONENTS; COMPUTER DESIGN; COST REDUCTION; DEEP SPACE; FABRICATION; FLIGHT CONTROL; MEMORY (COMPUTERS); MODULES; PACKAGING; SPACE COMMERCIALIZATION; TECHNOLOGY UTILIZATION
Other Descriptors: FLIGHT COMPUTER MCM; COMPUTER DESIGN SPACE APPLICATIONS MULTICHIP MODULES COST REDUCTION PACKAGING
Availability Source: Other Sources
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