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Rapid Selective Annealing of Cu Thin Films on Si Using MicrowavesA major goal of the semiconductor indurstry is to lower the processing temperatures needed for interconnects in silicon integrated circuits. Typical rapid thermal annealing processes heat the film as well as the substrate, creating device problems.
Document ID
20060038327
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Brain, R. A.
Atwater, H. A.
Watson, T. J.
Barmatz, M.
Date Acquired
August 23, 2013
Publication Date
April 1, 1994
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Other
Keywords
silicon integrated circuits microwave thin films

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