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Mechanical Stress Effects on Electromigration Voiding in a Meandering Test StripeEarlier experimental findings concluded that electromigratin voids in these meandering stripe test structures were not randomly distributed and that void nucleation frequenly occurred sub-surface at the metal/thermal oxide interface.
Document ID
20060038932
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Lowry, L. E.
Tai, B. H.
Mattila, J.
Walsh, L. H.
Date Acquired
August 23, 2013
Publication Date
April 1, 1993
Distribution Limits
Public
Copyright
Other
Keywords
mechanical stress metal/thermal oxide interface metal composition

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