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Investigation of low glass transition temperature on COTS PEM's reliability for space applicationsPlastic Encapsulated Microelectronics (PEM) reliability is affected by many factors. Glass transition temperature (Tg) is one such factor. In this presentation issues relating to PEM reliability and the effect of low glass transition temperature epoxy mold compounds are presented.
Document ID
20060039989
Document Type
Conference Paper
External Source(s)
hdl:2014/6559
Authors
Sandor, M.
Agarwal, S.
Peters, D.
Cooper, M. S.
Date Acquired
August 23, 2013
Publication Date
May 11, 2003
Distribution Limits
Public
Copyright
Other
Keywords
glass transition temperature reliability PEM

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