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CSP Assembly Reliability: Commercial and Harsh EnvironmentsThe JPL-led CSP Consortium of enterprises representing government agencies and private companies has jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
Document ID
20060040744
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Ghaffarian, R.
Kim, N.
Selk, K.
Bjorndahl, B.
Bonner, J.
Barr, S.
Date Acquired
August 23, 2013
Publication Date
September 12, 1999
Distribution Limits
Public
Copyright
Other
Keywords
chip scale package CSP Solder Joint Reliability Thermal Cycling

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