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X-Ray Exposure of Electron-Deposited Photoresist for Conformal Lithography on Corrugated SurfacesProximity printing using synchrotron X-ray lithography provides high resolution pattern transfer with large depth of field, low diffraction effects and no reflection from the substrate. Electro-plating of photo-resist allows deposition of thin, uniform films over geometrically complex and topographically diverse, electrically conductive surfaces.
Document ID
20060041113
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Hartley, F.
Malek, C.
Nguyen, S.
Date Acquired
August 23, 2013
Publication Date
February 22, 1998
Distribution Limits
Public
Copyright
Other
Keywords
Electron-deposited resist X-ray lithography Deep depth-of-field

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