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Chip Scale Package and Assembly Joint ReliabilityThe popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size.
Document ID
20060041625
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/20709
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
February 24, 1999
Distribution Limits
Public
Copyright
Other
Keywords
CSP Solder joint Reliability Thermal aging chip Scale Package SMT

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