NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
Solder joint fatigue analysis under low temperature Martian conditionsElectronics, without requiring heater power or enclosure in a centralized 'warm electronics box,' will need to survive mean surface temperatures of -120 degrees Celsius to +20 degrees Celsius for an extended Martian mission and an operational temperature up to 85 degrees Celsisus. Since these electronics will need to survive extended cycles under these conditions, fatigue is a significant concern. The solder joint reliability of connectors on a printed wiring board was investigated.
Document ID
20060043322
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Tudryn, Carissa
Date Acquired
August 23, 2013
Publication Date
March 1, 2006
Meeting Information
Meeting: 2006 IEEE Aerospace Conference
Location: Big Sky, MT
Country: United States
Start Date: March 4, 2006
End Date: March 11, 2006
Distribution Limits
Public
Copyright
Other
Keywords
low temperature
fatigue
Mars
solder

Available Downloads

There are no available downloads for this record.
No Preview Available