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Lead free 0201 assembly and thermal cycle/aging reliabilityThe many challenges with 0201 passive component assembly can be attributed to the solder paste volume, pad design, aperture design, board finish, type of solder paste, pick-and-place, and reflow profile. A Design-of-Experiment (DOE) study was carried out to investigate the effects of these parameters on assembly defects and reliability.
Document ID
20060044234
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/39414
Authors
Ghaffarian, Reza
Ramkumar, S. Manian
Varanasi, Arun
Date Acquired
August 23, 2013
Publication Date
February 8, 2005
Meeting Information
Meeting: APEX
Location: Anaheim, CA
Country: United States
Start Date: February 8, 2006
End Date: February 10, 2006
Distribution Limits
Public
Copyright
Other
Keywords
isothermal aging
thermal cycle
shear load
lead-free surface finish
modified apertures
lead-free process

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