NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
Design Parameters Influencing Reliability of CCGA Assembly: A Sensitivity AnalysisArea Array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of Ceramic Column Grid Array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50(deg)/75(deg)C, -55(deg)/100(deg)C, and -55(deg)/125(deg)C), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature da to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model's predictions with the experimental thermal cycling data. Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies.
Document ID
20060050287
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Tasooji, Amaneh
(Arizona State Univ. Tempe, AZ, United States)
Ghaffarian, Reza
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Rinaldi, Antonio
(Arizona State Univ. Tempe, AZ, United States)
Date Acquired
August 23, 2013
Publication Date
January 1, 2006
Subject Category
Engineering (General)
Meeting Information
Meeting: 56th Electronic Components and Technology Conference
Location: San Diego, CA
Country: United States
Start Date: May 30, 2006
End Date: June 2, 2006
Sponsors: Institute of Electrical and Electronics Engineers
Distribution Limits
Public
Copyright
Other
Keywords
reliability
thermal cycling
solder
lead free surface finish
aging
column grid array
microelectronic package
creep
Ceramic Column Grid Array (CCGA)

Available Downloads

There are no available downloads for this record.
No Preview Available