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Reconfiguration of Analog Electronics for Extreme Environments: Problem or Solution?This paper argues in favor of adaptive reconfiguration as a technique to expand the operational envelope of analog electronics for extreme environments (EE). In addition to hardening-by-process and hardening-by-design, "hardening-by-reconfiguration", when applicable, could be used to mitigate drifts, degradation, or damage on electronic devices (chips) in EE, by using re-configurable devices and an adaptive self-reconfiguration of their circuit topology. Conventional circuit design exploits device characteristics within a certain temperature/radiation range; when that is exceeded, the circuit function degrades. On a reconfigurable device, although component parameters change in EE, as long as devices still operate, albeit degraded, a new circuit design, suitable for new parameter values, may be mapped into the reconfigurable structure to recover the initial circuit function. Partly degraded resources are still used, while completely damaged resources are bypassed. Designs suitable for various environmental conditions can be determined prior to operation or can be determined in-situ, by adaptive reconfiguration algorithms running on built-in digital controllers. Laboratory demonstrations of this technique were performed by JPL in several independent experiments in which bulk CMOS reconfigurable devices were exposed to, and degraded by, low temperatures (approx. 196 C), high temperatures (approx.300 C) or radiation (300kRad TID), and then recovered by adaptive reconfiguration using evolutionary search algorithms. Taking this technology from Technology Readiness Level (TRL) 3 to TRL 5 is the target of a current NASA project.
Document ID
20060051442
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Stoica, Adrian
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Zebulum, Ricardo
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Keymeulen, Didier
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Guo, Xin
(Chromatech Alameda, CA, United States)
Date Acquired
August 23, 2013
Publication Date
January 1, 2005
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: IMAPS Advanced Technology Workshop on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Temperatures
Location: Pasadena, CA
Country: United States
Start Date: February 21, 2005
End Date: February 23, 2005
Distribution Limits
Public
Copyright
Other
Keywords
Field Programmable Transistor Array (FPTA)
temperature
evolvable hardware
radiation

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