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CMOS Active Pixel Sensor Technology and Reliability Characterization MethodologyThis paper describes the technology, design features and reliability characterization methodology of a CMOS Active Pixel Sensor. Both overall chip reliability and pixel reliability are projected for the imagers.
Document ID
20070030861
Document Type
Preprint (Draft being sent to journal)
External Source(s)
hdl:2014/40169
Authors
Chen, Yuan (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Guertin, Steven M. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Pain, Bedabrata (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Kayaii, Sammy (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 24, 2013
Publication Date
March 20, 2006
Subject Category
Optics
Meeting Information
Meeting: Government Microcircuit Applications and Critical Technology Conference
Location: San Diego, CA
Country: United States
Start Date: March 20, 2006
End Date: March 23, 2006
Distribution Limits
Public
Copyright
Other
Keywords
CMOS Active Pixel Sensors
low temperature
imaging sensor reliability
reliability analysis
pixel reliability

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