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Polymer based tunneling sensorA process for fabricating a polymer based circuit by the following steps. A mold of a design is formed through a lithography process. The design is transferred to a polymer substrate through a hot embossing process. A metal layer is then deposited over at least part of said design and at least one electrical lead is connected to said metal layer.
Document ID
20080008660
Acquisition Source
Stennis Space Center
Document Type
Other - Patent
Authors
Cui, Tianhong
Wang, Jing
Zhao, Yongjun
Date Acquired
August 24, 2013
Publication Date
August 22, 2006
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
Patent Number: US-Patent-7,094,622
Patent Application Number: US-Patent-Appl-SN-10/648,927
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-7,094,622
Patent Application
US-Patent-Appl-SN-10/648,927
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