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Evaluation of Silicon-on-Insulator HTOP-01 Operational Amplifier for Wide Temperature OperationElectronics capable of operation under extreme temperatures are required in many of NASA space exploration missions. Aerospace and military applications, as well as some terrestrial industries constitute environments where electronic systems are anticipated to be exposed to extreme temperatures and wide-range thermal swings. Electronics that are able to withstand and operate efficiently in such harsh environments would simplify, if not eliminate, traditional thermal control elements and their associated structures for proper ambient operation. As a result, overall system mass would be reduced, design would be simplified, and reliability would be improved. Electronic parts that are built utilizing silicon-on-insulator (SOI) technology are known to offer better radiation-tolerance compared to their conventional silicon counterparts, provide faster switching, and consume less power. They also exhibit reduced leakage current and, thus, they are often tailored for high temperature operation. These attributes make SOI-based devices suitable for use in harsh environments where extreme temperatures and wide thermal swings are anticipated. A new operational amplifier, based on silicon-on-insulator technology and geared for high temperature well-logging applications, was recently introduced by Honeywell Corporation. This HTOP-01 dual precision operational amplifier is a low power device, operates on a single supply, and has an internal oscillator and an external clocking option [1]. It is rated for operation from -55 C to +225 C with a maximum output current capability of 50 mA. The amplifier chip is designed as a 14-pin, hermetically-sealed device in a ceramic package. Table I shows some of the device manufacturer s specifications.
Document ID
Document Type
Other - Other
Patterson, Richard
(NASA Glenn Research Center Cleveland, OH, United States)
Hammoud, Ahmad
(ASRC Aerospace Corp. Cleveland, OH, United States)
Elbuluk, Malik
(Akron Univ. Akron, OH, United States)
Date Acquired
August 24, 2013
Publication Date
June 16, 2008
Subject Category
Electronics And Electrical Engineering
Funding Number(s)
Distribution Limits
Public Use Permitted.

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