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Embedded ESD Protection Proof of ConceptThe purpose of this project is to characterize and correlate Electrostatic Discharge (ESD) sensitivity levels of an Integrated Circuit (IC) package using Transmission Line Pulse (TLP) and Human Body Model (HBM) methods. This characterization will be used as a baseline ESD sensitivity level to demonstrate improvement to the ESD sensitivity of the IC package through the use of EPI-FLO(Trade Mark) Polymer Voltage Suppression (PVS) protection devices developed and manufactured by Electronic Polymers, Inc. (EPI).
Document ID
20090001805
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
hdl:2014/40937
Authors
Gerke, David (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Herrmann, Bill (Electronic Polymer, Inc. Round Rock, TX, United States)
Date Acquired
August 24, 2013
Publication Date
August 1, 2008
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
JPL-Publ-08-25
Funding Number(s)
WBS: WBS 939904.01.11.20
PROJECT: JPL Proj. 102197
Distribution Limits
Public
Copyright
Other
Keywords
Human Body Model (HBM) methods
Electrostatic Discharge (ESD)
Integrated Circuit (IC) package
Transmission Line Pulse (TLP)

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