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Assessment of SOI Devices and Circuits at Extreme TemperaturesElectronics designed for use in future NASA space exploration missions are expected to encounter extreme temperatures and wide thermal swings. Such missions include planetary surface exploration, bases, rovers, landers, orbiters, and satellites. Electronics designed for such applications must, therefore, be able to withstand exposure to extreme temperatures and to perform properly for the duration of mission. The Low Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electrical devices, circuits, and systems suitable for applications in deep space exploration missions and aerospace environment. Silicon-On-Insulator (SOI) technology has been under active consideration in the electronics industry for many years due to the advantages that it can provide in integrated circuit (IC) chips and computer processors. Faster switching, less power, radiationtolerance, reduced leakage, and high temp-erature capability are some of the benefits that are offered by using SOI-based devices. A few SOI circuits are available commercially. However, there is a noticeable interest in SOI technology for different applications. Very little data, however, exist on the performance of such circuits under cryogenic temperatures. In this work, the performance of SOI integrated circuits, evaluated under low temperature and thermal cycling, are reported. In particular, three examples of SOI circuits that have been tested for operation at low at temperatures are given. These circuits are SOI operational amplifiers, timers and power MOSFET drivers. The investigations were carried out to establish a baseline on the functionality and to determine suitability of these circuits for use in space exploration missions at cryogenic temperatures. The findings are useful to mission planners and circuit designers so that proper selection of electronic parts can be made, and risk assessment can be established for such circuits for use in space missions.
Document ID
20090004549
Document Type
Presentation
Authors
Elbuluk, Malik (Akron Univ. Akron, OH, United States)
Hammoud, Ahmad (QSS Group, Inc. Cleveland, OH, United States)
Patterson, Richard L. (NASA Glenn Research Center Cleveland, OH, United States)
Date Acquired
August 24, 2013
Publication Date
February 27, 2007
Subject Category
Electronics and Electrical Engineering
Report/Patent Number
E-16835
Meeting Information
International Microelectronics and Packaging Society 2nd Advanced Technology Workshop on Reliability of Advanced Electronic Packages and Devices in EXTREME COLD Environments(Los Angeles, CA)
Funding Number(s)
WBS: WBS 939904.01.03.02.01
CONTRACT_GRANT: GSN 017705
Distribution Limits
Public
Copyright
Public Use Permitted.

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