NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
Extreme High and Low Temperature Operation of the Silicon-On-Insulator Type CHT-OPA Operational AmplifierA new operational amplifier chip based on silicon-on-insulator technology was evaluated for potential use in extreme temperature environments. The CHT-OPA device is a low power, precision operational amplifier with rail-to-rail output swing capability, and it is rated for operation between -55 C and +225 C. A unity gain inverting circuit was constructed utilizing the CHT-OPA chip and a few passive components. The circuit was evaluated in the temperature range from -190 C to +200 C in terms of signal gain and phase shift, and supply current. The investigations were carried out to determine suitability of this device for use in space exploration missions and aeronautic applications under wide temperature incursion. Re-restart capability at extreme temperatures, i.e. power switched on while the device was soaked at extreme temperatures, was also investigated. In addition, the effects of thermal cycling under a wide temperature range on the operation of this high performance amplifier were determined. The results from this work indicate that this silicon-on-insulator amplifier chip maintained very good operation between +200 C and -190 C. The limited thermal cycling had no effect on the performance of the amplifier, and it was able to re-start at both -190 C and +200 C. In addition, no physical degradation or packaging damage was introduced due to either extreme temperature exposure or thermal cycling. The good performance demonstrated by this silicon-on-insulator operational amplifier renders it a potential candidate for use in space exploration missions or other environments under extreme temperatures. Additional and more comprehensive characterization is, however, required to establish the reliability and suitability of such devices for long term use in extreme temperature applications.
Document ID
20090004676
Document Type
Other
Authors
Patterson, Richard (NASA Glenn Research Center Cleveland, OH, United States)
Hammoud, Ahmad (ASRC Aerospace Corp. Cleveland, OH, United States)
Elbuluk, Malik (Akron Univ. Akron, OH, United States)
Date Acquired
August 24, 2013
Publication Date
January 11, 2008
Subject Category
Solid-State Physics
Report/Patent Number
E-16848
Funding Number(s)
CONTRACT_GRANT: NNC06BA07B
WBS: WBS 939904.01.03.02.01
Distribution Limits
Public
Copyright
Public Use Permitted.

Available Downloads

NameType 20090004676.pdf STI