Document Type
Presentation
Authors
Patterson, Richard L. (NASA Glenn Research Center Cleveland, OH, United States) Hammoud, Ahmad (ASRC Aerospace Corp. Cleveland, OH, United States) Elbuluk, Malik (Akron Univ. Akron, OH, United States) Date Acquired
August 24, 2013
Publication Date
February 27, 2007
Subject Category
Electronics And Electrical Engineering Meeting Information
International Microelectronics and Packaging Society 2nd Advanced Technology Workshop on Reliability of Advanced Electronic Packages and Devices in EXTREME COLD Environments,(Los Angeles, CA)
Funding Number(s)
WBS: WBS 939904.01.03.02.01
Distribution Limits
Public
Copyright
Public Use Permitted.
Available Downloads
20090004678.pdf STIcloud_downloadcontent_copyvisibility