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Electronics for Low Temperature Space Exploration MissionsExploration missions to outer planets and deep space require spacecraft, probes, and on-board data and communication systems to operate reliably and efficiently under severe harsh conditions. On-board electronics, in particular those in direct exposures to the space environment without any shielding or protection, will encounter extreme low temperature and thermal cycling in their service cycle in most of NASA s upcoming exploration missions. For example, Venus atmosphere, Jupiter atmosphere, Moon surface, Pluto orbiter, Mars, comets, Titan, Europa, and James Webb Space Telescope all involve low-temperature surroundings. Therefore, electronics for space exploration missions need to be designed for operation under such environmental conditions. There are ongoing efforts at the NASA Glenn Research Center (GRC) to establish a database on the operation and reliability of electronic devices and circuits under extreme temperature operation for space applications. This work is being performed under the Extreme Temperature Electronics Program with collaboration and support of the NASA Electronic Parts and Packaging (NEPP) Program. The results of these investigations will be used to establish safe operating areas and to identify degradation and failure modes, and the information will be disseminated to mission planners and system designers for use as tools for proper part selection and in risk mitigation. An overview of this program along with experimental data will be presented.
Document ID
20090004678
Document Type
Presentation
Authors
Patterson, Richard L. (NASA Glenn Research Center Cleveland, OH, United States)
Hammoud, Ahmad (ASRC Aerospace Corp. Cleveland, OH, United States)
Elbuluk, Malik (Akron Univ. Akron, OH, United States)
Date Acquired
August 24, 2013
Publication Date
February 27, 2007
Subject Category
Electronics and Electrical Engineering
Report/Patent Number
E-16852
Meeting Information
International Microelectronics and Packaging Society 2nd Advanced Technology Workshop on Reliability of Advanced Electronic Packages and Devices in EXTREME COLD Environments,(Los Angeles, CA)
Funding Number(s)
WBS: WBS 939904.01.03.02.01
Distribution Limits
Public
Copyright
Public Use Permitted.

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