Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
Authors
Ramesham, Rajeshuni (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States) Ghaffarian, Reza (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States) Shapiro, Andrew (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States) Napala, Phil A. (NASA Headquarters Washington, DC United States) Martin, Patrick A. (NASA Headquarters Washington, DC United States) Date Acquired
August 24, 2013
Publication Date
February 21, 2005
Subject Category
Electronics And Electrical Engineering Meeting Information
Meeting: Reliability of Advanced Electronic Packages and Devices in Extreme Environments
Location: Pasadena, CA
Country: United States
Start Date: February 21, 2005
End Date: February 23, 2005
Distribution Limits
Public
Keywords
thermal cyclingflip chipextreme temperatures