Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
Authors
Holland, Brian (Auburn Univ. AL, United States) McPherson, Ryan (Auburn Univ. AL, United States) Zhang, Tan (Auburn Univ. AL, United States) Hou, Zhenwei (Auburn Univ. AL, United States) Dean, Robert (Auburn Univ. AL, United States) Johnson, R. Wayne (Auburn Univ. AL, United States) DelCastillo, Linda (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States) Moussessian, Alina (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States) Date Acquired
August 24, 2013
Publication Date
May 17, 2008
Subject Category
Electronics And Electrical Engineering Meeting Information
Meeting: 58th Electronic Components and Technology Conference, 2008 (ECTC 2008)
Location: Lake Buena Vista, FL
Country: United States
Start Date: May 27, 2008
End Date: May 30, 2008
Sponsors: Institute of Electrical and Electronics Engineers
Distribution Limits
Public
Keywords
electronics packagingbonding processesflexible electronicsflip chip devices