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Ultra-Thin, Flexible ElectronicsThinned die can be used to realize ultra-thin flexible electronics for applications such as conformal and wearable electronics. Three techniques have been developed to achieve this goal using thinned die: die flip chip bonded onto flexible substrates, die laminated onto LCP films, and die embedded in polyimide. A key to achieving each of these techniques is the thinning of die to a thickness of 50 microns or thinner. Conventional CMP processing can be used to thin to 50 microns. At 50 microns, the active die become flexible and must be handled by temporarily bonding them to a holder die, for further processing. Once bonded face down to the holder die, the active die can be further thinned by DRIE etching the exposed backside. The thinned die can then been packaged in or on the flexible substrate.
Document ID
20090026411
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
Authors
Holland, Brian
(Auburn Univ. AL, United States)
McPherson, Ryan
(Auburn Univ. AL, United States)
Zhang, Tan
(Auburn Univ. AL, United States)
Hou, Zhenwei
(Auburn Univ. AL, United States)
Dean, Robert
(Auburn Univ. AL, United States)
Johnson, R. Wayne
(Auburn Univ. AL, United States)
DelCastillo, Linda
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Moussessian, Alina
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 24, 2013
Publication Date
May 17, 2008
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: 58th Electronic Components and Technology Conference, 2008 (ECTC 2008)
Location: Lake Buena Vista, FL
Country: United States
Start Date: May 27, 2008
End Date: May 30, 2008
Sponsors: Institute of Electrical and Electronics Engineers
Distribution Limits
Public
Copyright
Other
Keywords
electronics packaging
bonding processes
flexible electronics
flip chip devices

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