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Solder Joint Health Monitoring Testbed SystemThe density and pin count for Field Programmable Gate Arrays (FPGAs) has been increasing, and has exceeded current methods of solder joint inspection, making early detection of failures more problematic. These failures are a concern for both flight safety and maintenance in commercial aviation. Ridgetop Group, Inc. has developed a method for detecting solder joint failures in real time. The NASA Dryden Flight Research Center is developing a set of boards to test this method in ground environmental and accelerated testing as well as flight test on a Dryden F-15 or F-18 research aircraft. In addition to detecting intermittent and total solder joint failures, environmental data on the boards, such as temperature and vibration, will be collected and time-correlated to aircraft state data. This paper details the technical approach involved in the detection process, and describes the design process and products to date for Dryden s FPGA failure detection boards.
Document ID
20090033694
Acquisition Source
Armstrong Flight Research Center
Document Type
Conference Paper
Authors
Delaney, Michael M.
(NASA Dryden Flight Research Center Edwards, CA, United States)
Date Acquired
August 24, 2013
Publication Date
August 31, 2009
Subject Category
Air Transportation And Safety
Report/Patent Number
DFRC-1013
Meeting Information
Meeting: Military/Aerospace Programmable Logic Device 2009 (MAPLD 2009)
Location: Greenbelt, MD
Country: United States
Start Date: August 31, 2009
End Date: September 3, 2009
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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