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Analytical Predictions of Thermal Stress in the Stardust PICA Heatshield Under Reentry Flight ConditionsWe performed finite element analyses on a model of the Phenolic Impregnated Carbon Ablator (PICA) heatshield from the Stardust sample return capsule (SRC) to predict the thermal stresses in the PICA material during reentry. The heatshield on the Stardust SRC was a 0.83 m sphere cone, fabricated from a single piece of 5.82 cm-thick PICA. The heatshield performed successfully during Earth reentry of the SRC in January 2006. Material response analyses of the full, axisymmetric PICA heatshield were run using the Two-Dimensional Implicit Ablation, Pyrolysis, and Thermal Response Program (TITAN). Peak surface temperatures were predicted to be 3385K, while the temperature at the PICA backface remained at the estimated initial cold-soak temperature of 278K. Surface recession and temperature distribution results from TITAN, at several points in the reentry trajectory, were mapped onto an axisymmetric finite element model of the heatshield. We used the finite element model to predict the thermal stresses in the PICA from differential thermal expansion. The predicted peak compressive stress in the PICA heatshield was 1.38 MPa. Although this level of stress exceeded the chosen design limit for compressive stresses in PICA tiles for the design of the Orion crew exploration vehicle heatshield, the Stardust heatshield exhibited no obvious mechanical failures from thermal stress. The analyses of the Stardust heatshield were used to assess and adjust the level of conservatism in the finite element analyses in support of the Orion heatshield design.
Document ID
20090033818
Acquisition Source
Ames Research Center
Document Type
Conference Paper
Authors
Squire, Thomas
(NASA Ames Research Center Moffett Field, CA, United States)
Milos, Frank
(NASA Ames Research Center Moffett Field, CA, United States)
Agrawal, Parul
(Eloret Corp. Moffett Field, CA, United States)
Date Acquired
August 24, 2013
Publication Date
June 22, 2009
Subject Category
Spacecraft Design, Testing And Performance
Report/Patent Number
ARC-E-DAA-TN-297
TSM-0003
Meeting Information
Meeting: 2009 National Space and Missile Materials Symposium
Location: Scottsdale, AZ
Country: United States
Start Date: June 28, 2009
End Date: July 1, 2009
Sponsors: General Dynamics Information Technology
Distribution Limits
Public
Copyright
Other

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