Acquisition Source
Jet Propulsion Laboratory
Document Type
Reprint (Version printed in journal)
Authors
Ghaffarian, Reza (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States) Date Acquired
August 24, 2013
Publication Date
January 1, 2008
Publication Information
Publication: International Journal of Materials and Structural Integrity
Volume: 2
Issue: 1/2
Subject Category
Electronics And Electrical Engineering Distribution Limits
Public
Keywords
fill vialead-freedelaminationmicroviaPrinted Wiring Board (PWB)Plated Through Hole (PTH)glass transition temperature (Tg)Coefficient of Thermal Expansion (CTE)thermal damage