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Reinforced Thermoplastic Polyimide with Dispersed Functionalized Single Wall Carbon NanotubesMolecular pi-complexes were formed from pristine HiPCO single-wall carbon nanotubes (SWCNTs) and 1-pyrene- N-(4- N'-(5-norbornene-2,3-dicarboxyimido)phenyl butanamide, 1. Polyimide films were prepared with these complexes as well as uncomplexed SWCNTs and the effects of nanoadditive addition on mechanical, thermal, and electrical properties of these films were evaluated. Although these properties were enhanced by both nanoadditives, larger increases in tensile strength and thermal and electrical conductivities were obtained when the SWCNT/1 complexes were used. At a loading level of 5.5 wt %, the Tg of the polyimide increased from 169 to 197 C and the storage modulus increased 20-fold (from 142 to 3045 MPa). The addition of 3.5 wt % SWCNT/1 complexes increased the tensile strength of the polyimide from 61.4 to 129 MPa; higher loading levels led to embrittlement and lower tensile strengths. The electrical conductivities (DC surface) of the polyimides increased to 1 x 10(exp -4) Scm(exp -1) (SWCNT/1 complexes loading level of 9 wt %). Details of the preparation of these complexes and their effects on polyimide film properties are discussed.
Document ID
Acquisition Source
Glenn Research Center
Document Type
Reprint (Version printed in journal)
External Source(s)
Lebron-Colon, Marisabel
(NASA Glenn Research Center Cleveland, OH, United States)
Meador, Michael A.
(NASA Glenn Research Center Cleveland, OH, United States)
Gaier, James R.
(NASA Glenn Research Center Cleveland, OH, United States)
Sola, Francisco
(NASA Glenn Research Center Cleveland, OH, United States)
Scheiman, Daniel A.
(ASRC Aerospace Corp. Cleveland, OH, United States)
McCorkle, Linda S.
(Ohio Aerospace Inst. Cleveland, OH, United States)
Date Acquired
August 25, 2013
Publication Date
February 10, 2010
Publication Information
Publication: Applied Materials and Interfaces
Publisher: ACS Publications
Volume: 2
Issue: 3
Subject Category
Composite Materials
Report/Patent Number
Funding Number(s)
WBS: WBS 561581.
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