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PVD Silicon Carbide as a Thin Film Packaging Technology for Antennas on LCP Substrates for Harsh EnvironmentsThis paper describes an effort to develop a thin film packaging technology for microfabricated planar antennas on polymeric substrates based on silicon carbide (SiC) films deposited by physical vapor deposition (PVD). The antennas are coplanar waveguide fed dual frequency folded slot antennas fabricated on liquid crystal polymer (LCP) substrates. The PVD SiC thin films were deposited directly onto the antennas by RF sputtering at room temperature at a chamber pressure of 30 mTorr and a power level of 300 W. The SiC film thickness is 450 nm. The return loss and radiation patterns were measured before and after the SiC-coated antennas were submerged into perchloric acid for 1 hour. No degradation in RF performance or physical integrity of the antenna was observed.
Document ID
20110016112
Acquisition Source
Glenn Research Center
Document Type
Conference Paper
Authors
Scardelletti, Maximilian C.
(NASA Glenn Research Center Cleveland, OH, United States)
Stanton, John W.
(Case Western Reserve Univ. Cleveland, OH, United States)
Ponchak, George E.
(NASA Glenn Research Center Cleveland, OH, United States)
Jordan, Jennifer L.
(NASA Glenn Research Center Cleveland, OH, United States)
Zorman, Christian A.
(Case Western Reserve Univ. Cleveland, OH, United States)
Date Acquired
August 25, 2013
Publication Date
January 10, 2010
Subject Category
Communications And Radar
Report/Patent Number
E-17959
Meeting Information
Meeting: 2010 IEEE Radio and Wireless Symposium
Location: New Orleans, LA
Country: United States
Start Date: January 10, 2010
End Date: January 14, 2010
Sponsors: Institute of Electrical and Electronics Engineers
Funding Number(s)
WBS: WBS 645646.02:07.03.11.04.02
Distribution Limits
Public
Copyright
Other

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