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Development of High Temperature SiC Based Hydrogen/Hydrocarbon Sensors with Bond Pads for PackagingThis paper describes efforts towards the transition of existing high temperature hydrogen and hydrocarbon Schottky diode sensor elements to packaged sensor structures that can be integrated into a testing system. Sensor modifications and the technical challenges involved are discussed. Testing of the sensors at 500 C or above is also presented along with plans for future development.
Document ID
20120004161
Acquisition Source
Glenn Research Center
Document Type
Conference Paper
Authors
Xu, Jennifer C.
(NASA Glenn Research Center Cleveland, OH, United States)
Hunter, Gary W.
(NASA Glenn Research Center Cleveland, OH, United States)
Chen, Liangyu
(Ohio Aerospace Inst. Brook Park, OH, United States)
Biagi-Labiosa, Azlin M.
(NASA Glenn Research Center Cleveland, OH, United States)
Ward, Benjamin J.
(Makel Engineering, Inc. Cleveland, OH, United States)
Lukco, Dorothy
(ASRC Aerospace Corp. Cleveland, OH, United States)
Gonzalez, Jose M., III
(Gilcrest Corp. Cleveland, OH, United States)
Lampard, Peter S.
(Sierra Lobo, Inc. Cleveland, OH, United States)
Artale, Michael A.
(Sierra Lobo, Inc. Cleveland, OH, United States)
Hampton, Christopher L.
(Sierra Lobo, Inc. Cleveland, OH, United States)
Date Acquired
August 25, 2013
Publication Date
September 11, 2011
Subject Category
Instrumentation And Photography
Report/Patent Number
E-18166
Meeting Information
Meeting: 2011 International Conference on Silicon Carbide and Related Materials (ICSCRM 2011)
Location: Cleveland, OH
Country: United States
Start Date: September 11, 2011
End Date: September 16, 2011
Distribution Limits
Public
Copyright
Public Use Permitted.
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