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NASA Electronic Parts and Packaging (NEPP) ProgramRecent Findings from Audits, New Technology Data Reviews a) Disabled Chip Burn-ins A recent audit for a QML device discovered that the chip was disabled during the static burn-in, thus it was not drawing any current. Recommendation: For new SMDs add a statement within the burn-in paragraphs stating that the parts shall be kept in their enabled state during the burn-in. b) Class Q 160-hr/125oC Burn-in This is being interpreted as a static burn-in (even for CMOS technology). Recommendation: Provide clarification in MIL-STD-883, Test Method 5004. c) At Frequency (Dynamic) Burn-ins Test equipment limitation is being cited for not doing burn-ins at the application frequency. Recommendation: The burn-in task group to discuss and provide guidance. When the SMD says that the part can be used at 200 MHz, then doing burn-in at 6 MHz (cited as burn-in equipment limitation frequency) is not going to be meaningful! d) Two Static Burn-ins Some manufacturers are doing electrical testing between the two static burn-ins, whereas others do electricals after completing both static burn-ins. Recommendation: Provide clarification in MIL-STD-883, Test Method 5004. e) Thermal Imaging For a device with hot spots, the thermal resistance, junction-to-case, would be much higher than the guidelines given in MIL-STD-1835. One of the suppliers used thermal imaging to find hot spots on the die. Recommendation: Assign a task group to evaluate the effectiveness of thermal imaging at the product development stage.
Document ID
20130010671
Acquisition Source
Jet Propulsion Laboratory
Document Type
Presentation
External Source(s)
Authors
Agarwal, Shri
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 27, 2013
Publication Date
June 11, 2012
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: 3rd NASA Electronic Parts and Packaging (NEPP) Program Electronic Technology Workshop
Location: Greenbelt, MD
Country: United States
Start Date: June 11, 2012
End Date: June 13, 2012
Distribution Limits
Public
Copyright
Other
Keywords
Class Y
NASA Electronic Parts and Packaging (NEPP)
NASA EEE Parts Assurance Group (NEPAG)
Electronics Technology Workshop (ETW)
G-12

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