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High-Throughput Top-Down and Bottom-Up Processes for Forming Single-Nanotube Based Architectures for 3D ElectronicsWe have developed manufacturable approaches to form single, vertically aligned carbon nanotubes, where the tubes are centered precisely, and placed within a few hundred nm of 1-1.5 micron deep trenches. These wafer-scale approaches were enabled by chemically amplified resists and inductively coupled Cryo-etchers for forming the 3D nanoscale architectures. The tube growth was performed using dc plasma-enhanced chemical vapor deposition (PECVD), and the materials used for the pre-fabricated 3D architectures were chemically and structurally compatible with the high temperature (700 C) PECVD synthesis of our tubes, in an ammonia and acetylene ambient. Tube characteristics were also engineered to some extent, by adjusting growth parameters, such as Ni catalyst thickness, pressure and plasma power during growth. Such scalable, high throughput top-down fabrication techniques, combined with bottom-up tube synthesis, should accelerate the development of PECVD tubes for applications such as interconnects, nano-electromechanical (NEMS), sensors or 3D electronics in general.
Document ID
20150006079
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Kaul, Anupama B.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Megerian, Krikor G.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
von Allmen, Paul
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Kowalczyk, Robert
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Baron, Richard
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
April 22, 2015
Publication Date
April 15, 2009
Subject Category
Nonmetallic Materials
Mechanical Engineering
Electronics And Electrical Engineering
Meeting Information
Meeting: 2009 MRS Spring Meeting & Exhibit
Location: San Francisco, CA
Country: United States
Start Date: April 13, 2009
End Date: April 17, 2009
Sponsors: Materials Research Society
Distribution Limits
Public
Copyright
Other
Keywords
plasma-enhanced chemical vapor deposition (PECVD),
3D electronics
nanofabrication
top dpwn fabrication

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