Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
Authors
Decrossas, Emmanuel (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States) Glover, Michael D. (Arkansas Univ. Fayetteville, AR, United States) Porter, Kaoru (Arkansas Univ. Fayetteville, AR, United States) Cannon, Tom (Arkansas Univ. Fayetteville, AR, United States) Mantooth, H. Alan (Arkansas Univ. Fayetteville, AR, United States) Hamilton, M. C. (Auburn Univ. AL, United States) Date Acquired
May 5, 2015
Publication Date
October 6, 2013
Subject Category
Communications And RadarElectronics And Electrical Engineering Meeting Information
Meeting: European Microwave Week 2013
Location: Nuremberg
Country: Germany
Start Date: October 6, 2013
End Date: October 11, 2013
Sponsors: Institution of Engineering and Technology (IET), Institute of Electrical and Electronics Engineers, VDE - Association for Electrical, Electronics and Information Technologies, European Microwave Association (EuMA)
Distribution Limits
Public
Keywords
Full-tape-thickness feature; LTCC 9K7 interconnect; multi-chip-modulequasi-coaxial vertical transitionsignal integritysystem on package (SOP)