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Broad Frequency LTCC Vertical Interconnect Transition for Multichip Modules and System on Package ApplicationsVarious stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4 millimeter connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont (sup trademark) 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from Direct Current to 50 gigahertz and beyond.
Document ID
20150007364
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Decrossas, Emmanuel
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Glover, Michael D.
(Arkansas Univ. Fayetteville, AR, United States)
Porter, Kaoru
(Arkansas Univ. Fayetteville, AR, United States)
Cannon, Tom
(Arkansas Univ. Fayetteville, AR, United States)
Mantooth, H. Alan
(Arkansas Univ. Fayetteville, AR, United States)
Hamilton, M. C.
(Auburn Univ. AL, United States)
Date Acquired
May 5, 2015
Publication Date
October 6, 2013
Subject Category
Communications And Radar
Electronics And Electrical Engineering
Meeting Information
Meeting: European Microwave Week 2013
Location: Nuremberg
Country: Germany
Start Date: October 6, 2013
End Date: October 11, 2013
Sponsors: Institution of Engineering and Technology (IET), Institute of Electrical and Electronics Engineers, VDE - Association for Electrical, Electronics and Information Technologies, European Microwave Association (EuMA)
Distribution Limits
Public
Copyright
Other
Keywords
Full-tape-thickness feature; LTCC 9K7 interconnect; multi-chip-module
quasi-coaxial vertical transition
signal integrity
system on package (SOP)

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