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A Study of Solder Alloy Ductility for Cryogenic ApplicationsFor aerospace applications it is important to understand the mechanical performance of components at the extreme temperature conditions seen in service. For solder alloys used in microelectronics, cryogenic temperatures can prove problematic. At low temperatures Sn-based solders undergo a ductile to brittle transition that leads to brittle cracks, which can result in catastrophic failure of electronic components, assemblies and spacecraft payloads. As industrial processes begin to move away from Pb-Sn solder, it is even more critical to characterize the behavior of alternative Sn-based solders. Here we report on initial investigations using a modified Charpy test apparatus to characterize the ductile to brittle transformation temperature of nine different solder systems.
Document ID
20150007999
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Lupinacci, A.
(California Univ. Berkeley, CA, United States)
Shapiro, A. A.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Suh, J-O.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Minor, A. M.
(California Univ. Berkeley, CA, United States)
Date Acquired
May 12, 2015
Publication Date
February 27, 2013
Subject Category
Metals And Metallic Materials
Meeting Information
Meeting: IEEE International Symposium and Exhibition on Advanced Packaging Materials
Location: Irvine, CA
Country: United States
Start Date: February 27, 2013
End Date: March 1, 2013
Sponsors: Institute of Electrical and Electronics Engineers
Distribution Limits
Public
Copyright
Other
Keywords
solders
cryogenic
ductile to brittle transition temperature (DBTT)

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