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Record Details

Record 2 of 8864
Integrated Arrays on Silicon at Terahertz Frequencies
External Online Source: hdl:2014/45029
Author and Affiliation:
Chattopadhayay, Goutam(Jet Propulsion Lab., California Inst. of Tech., Pasadena, CA, United States)
Lee, Choonsup(Jet Propulsion Lab., California Inst. of Tech., Pasadena, CA, United States)
Jung, Cecil(Jet Propulsion Lab., California Inst. of Tech., Pasadena, CA, United States)
Lin, Robert(Jet Propulsion Lab., California Inst. of Tech., Pasadena, CA, United States)
Peralta, Alessandro(Jet Propulsion Lab., California Inst. of Tech., Pasadena, CA, United States)
Mehdi, Imran(Jet Propulsion Lab., California Inst. of Tech., Pasadena, CA, United States)
Llombert, Nuria(Universidad Complutense, Madrid, Spain)
Thomas, Bertrand(Radiometer-Physics G.m.b.H., Meckenheim, Germany)
Abstract: In this paper we explore various receiver font-end and antenna architecture for use in integrated arrays at terahertz frequencies. Development of wafer-level integrated terahertz receiver front-end by using advanced semiconductor fabrication technologies and use of novel integrated antennas with silicon micromachining are reported. We report novel stacking of micromachined silicon wafers which allows for the 3-dimensional integration of various terahertz receiver components in extremely small packages which easily leads to the development of 2- dimensioanl multi-pixel receiver front-ends in the terahertz frequency range. We also report an integrated micro-lens antenna that goes with the silicon micro-machined front-end. The micro-lens antenna is fed by a waveguide that excites a silicon lens antenna through a leaky-wave or electromagnetic band gap (EBG) resonant cavity. We utilized advanced semiconductor nanofabrication techniques to design, fabricate, and demonstrate a super-compact, low-mass submillimeter-wave heterodyne frontend. When the micro-lens antenna is integrated with the receiver front-end we will be able to assemble integrated heterodyne array receivers for various applications such as multi-pixel high resolution spectrometer and imaging radar at terahertz frequencies.
Publication Date: Jul 03, 2011
Document ID:
20150008810
(Acquired May 28, 2015)
Subject Category: COMMUNICATIONS AND RADAR
Document Type: Conference Paper
Meeting Information: IEEE International Symposium on Antennas and Propagation; 3-8 Jul. 2011; Spokane, WA; United States
Meeting Sponsor: Institute of Electrical and Electronics Engineers; New York, NY, United States
Financial Sponsor: Jet Propulsion Lab., California Inst. of Tech.; Pasadena, CA, United States
Description: 4p; In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: Copyright
NASA Terms: HIGH RESOLUTION; FREQUENCIES; RECEIVERS; ANTENNA DESIGN; SEMICONDUCTOR DEVICES; WAFERS; SUBMILLIMETER WAVES; NANOFABRICATION; FABRICATION; MICROMACHINING; PIXELS; HETERODYNING
Other Descriptors: SILICON MICROMACHING; ARRAY RECEIVERS
Availability Source: Other Sources
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