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Reliability of Solder Materials (Sn-Pb and Pb-Free) for Deep Space MissionsThe purpose of this study is to assess the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead (Sn-Pb) and lead-free (Pb-Free) solder alloys under extreme temperature deep space environments.



Document ID
20150008826
Acquisition Source
Jet Propulsion Laboratory
Document Type
Presentation
External Source(s)
hdl:2014/45045
Authors
Ramesham, Rajeshuni (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
May 26, 2015
Publication Date
July 17, 2011
Subject Category
Metals And Metallic Materials
Meeting Information
Meeting: International Conference on Environmental Systems (ICES)
Location: Portland, OR
Country: United States
Start Date: July 17, 2011
End Date: July 21, 2011
Sponsors: American Inst. of Aeronautics and Astronautics, American Society of Mechanical Engineers, American Inst. of Chemical Engineers
Distribution Limits
Public
Copyright
Other
Keywords
extreme temperatures
tin-lead

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