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Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and ReliabilityBottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.
Document ID
20160002480
Document Type
Other
External Source(s)
Authors
Ghaffarian, Reza (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
March 1, 2016
Publication Date
October 1, 2014
Subject Category
Electronics and Electrical Engineering
Report/Patent Number
JPL-Publ-14-17
Funding Number(s)
WBS: WBS 724297.40.43
PROJECT: Proj. 104593
TASK: Task 40.49.02.28
Distribution Limits
Public
Copyright
Other
Keywords
MLF
solder joint reliability
IPC 7093
bottom termination component

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