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Separating the Influence of Environment from Stress Relaxation Effects on Dwell Fatigue Crack Growth in a Nickel-Base Disk AlloyBoth environmental embrittlement and crack tip visco-plastic stress relaxation play a significant role in determining the dwell fatigue crack growth (DFCG) resistance of nickel-based disk superalloys. In the current study performed on the Low Solvus High Refractory (LSHR) disk alloy, the influence of these two mechanisms were separated so that the effects of each could be quantified and modeled. Seven different microstructural variations of LSHR were produced by controlling the cooling rate and the subsequent aging and thermal exposure heat treatments. Through cyclic fatigue crack growth testing performed both in air and vacuum, it was established that four out of the seven LSHR heat treatments evaluated, possessed similar intrinsic environmental resistance to cyclic crack growth. For these four heat treatments, it was further shown that the large differences in dwell crack growth behavior which still persisted, were related to their measured stress relaxation behavior. The apparent differences in their dwell crack growth resistance were attributed to the inability of the standard linear elastic fracture mechanics (LEFM) stress intensity parameter to account for visco-plastic behavior. Crack tip stress relaxation controls the magnitude of the remaining local tensile stresses which are directly related to the measured dwell crack growth rates. It was hypothesized that the environmentally weakened grain boundary crack tip regions fail during the dwells when their strength is exceeded by the remaining local crack tip tensile stresses. It was shown that the classical creep crack growth mechanisms such as grain boundary sliding did not contribute to crack growth, but the local visco-plastic behavior still plays a very significant role by determining the crack tip tensile stress field which controls the dwell crack growth behavior. To account for the influence of the visco-plastic behavior on the crack tip stress field, an empirical modification to the LEFM stress intensity parameter, Kmax, was developed by incorporating into the formulation the remaining stress level concept as measured by simple stress relaxation tests. The newly proposed parameter, Ksrf, did an excellent job in correlating the dwell crack growth rates for the four heat treatments which were shown to have similar intrinsic environmental cyclic fatigue crack growth resistance.
Document ID
20160011210
Acquisition Source
Glenn Research Center
Document Type
Conference Paper
Authors
Telesman, J.
(NASA Glenn Research Center Cleveland, OH, United States)
Gabb, T. P.
(NASA Glenn Research Center Cleveland, OH United States)
Ghosn, L. J.
(NASA Glenn Research Center Cleveland, OH, United States)
Date Acquired
September 13, 2016
Publication Date
September 11, 2016
Subject Category
Metals And Metallic Materials
Report/Patent Number
GRC-E-DAA-TN29877
Meeting Information
Meeting: International Symposium on Superalloys
Location: Seven Springs, PA
Country: United States
Start Date: September 11, 2016
End Date: September 15, 2016
Sponsors: Minerals, Metals and Materials Society
Funding Number(s)
WBS: WBS 081876.02.03.04
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Keywords
Dwell crack growth
life prediction
environmental damage
stress relaxation
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