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Radiation and Temperature Hard Multi-Pixel Avalanche PhotodiodesThe structure and method of fabricating a radiation and temperature hard avalanche photodiode with integrated radiation and temperature hard readout circuit, comprising a substrate, an avalanche region, an absorption region, and a plurality of Ohmic contacts are presented. The present disclosure provides for tuning of spectral sensitivity and high device efficiency, resulting in photon counting capability with decreased crosstalk and reduced dark current.
Document ID
20170006158
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
Bensaoula, Abdelhak
Starikov, David
Pillai, Rajeev
Date Acquired
July 6, 2017
Publication Date
June 27, 2017
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-9,691,933
Patent Application
US-Patent-Appl-SN-14/667,024
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