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Development of Stable, Low Resistance Solder Joints for a Space-Flight HTS Lead AssembliesThe solder joints in spaceflight high temperature superconductor (HTS) lead assemblies for certain astrophysics missions have strict constraints on size and power dissipation. In addition, the joints must tolerate years of storage at room temperature, many thermal cycles, and several vibration tests between their manufacture and their final operation on orbit. As reported previously, solder joints between REBCO coated conductors and normal metal traces for the Astro-H mission showed low temperature joint resistance that grew approximately as log time over the course of months. Although the assemblies worked without issue in orbit, for the upcoming X-ray Astrophysics Recovery Mission we are attempting to improve our solder process to give lower, more stable, and more consistent joint resistance. We produce numerous sample joints and measure time- and thermal cycle-dependent resistance, and characterize the joints using x-ray and other analysis tools. For a subset of the joints, we use SEMEDS to try to understand the physical and chemical processes that effect joint behavior.
Document ID
20170006543
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Canavan, Edgar R.
(NASA Goddard Space Flight Center Greenbelt, MD United States)
Chiao, Meng
(Alcyon Technical Services-JV, Inc. Huntsville, AL, United States)
Panashchenko, Lyudmyla
(NASA Goddard Space Flight Center Greenbelt, MD United States)
Sampson, Michael
(Stinger Ghaffarian Technologies, Inc. Greenbelt, MD, United States)
Date Acquired
July 13, 2017
Publication Date
July 9, 2017
Subject Category
Metals And Metallic Materials
Report/Patent Number
GSFC-E-DAA-TN44039
Meeting Information
Meeting: Joint Cryogenic Engineering Conference (CEC) and International Cryogenic Materials Conference (ICMC) 2017
Location: Madison, WI
Country: United States
Start Date: July 9, 2017
End Date: July 13, 2017
Sponsors: Fermilab Particle Astrophysics Center
Funding Number(s)
CONTRACT_GRANT: NNG15CR64C
CONTRACT_GRANT: NNG15CR66C
Distribution Limits
Public
Copyright
Public Use Permitted.
Keywords
high temperature superconductivity
superconductivity
solder
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