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Virtex-5 CN Package Daisy Chain Evaluation Test ReportThe board-level temperature cycling reliability of Xilinx Virtex-5 (V5) CN package was investigated. V5s were temperature cycled under two conditions, 0 to +100 C (0/100) and -55 to +100 C (-55/100). During the 0/100 test, no part out of 8 parts failed up to 6586 cycles. During the -55/100 test, one part out of 8 parts failed at 1236 cycle, and there were no additional failures up to 1705 cycles. The failure mode of the part that failed at 1236 cycles indicated that most likely the failure was not a solder fatigue failure, and therefore no obvious solder fatigue failure was observed throughout the tests.
Document ID
20170008013
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
Authors
Suh, Jong-ook
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 29, 2017
Publication Date
January 21, 2016
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
JPL-Publ-16-3
Funding Number(s)
CONTRACT_GRANT: NAS7-03001
PROJECT: JPL Proj. 104593
WBS: WBS 40.49.02.20
Distribution Limits
Public
Copyright
Public Use Permitted.
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