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Life Cycle Analysis of a SpaceCube Printed Circuit Board Assembly Using Physics of Failure MethodologiesIn this reliability life cycle evaluation of the SpaceCube 2.0 processor card, a partially populated version of the card is being evaluated to determine its durability with respect to typical GSFC mission loads.
Document ID
20180002229
Acquisition Source
Goddard Space Flight Center
Document Type
Other
Authors
Sood, Bhanu
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Evans, John
(NASA Headquarters Washington, DC United States)
Daniluk, Kelly
(ARES Corp. Greenbelt, MD, United States)
Sturgis, Jason
(ARES Corp. Greenbelt, MD, United States)
Davis, Milton
(NASA Headquarters Washington, DC United States)
Petrick, David
(NASA Headquarters Washington, DC United States)
Date Acquired
April 10, 2018
Publication Date
January 1, 2017
Subject Category
Computer Operations And Hardware
Quality Assurance And Reliability
Report/Patent Number
GSFC-E-DAA-TN45821
Distribution Limits
Public
Copyright
Public Use Permitted.
Keywords
Virtual Qualification
Reliability
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