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Copper-Water and Hybrid Aluminum-Ammonia Heat Pipes for Spacecraft Thermal Control ApplicationsCopper-water heat pipes are commonly used for thermal management of electronics systems on earth and aircraft, but have not been used in spacecraft thermal control applications to date, due to the satellite industry's requirement that any device or system be successfully tested in a microgravity environment prior to adoption. Recently, Advanced Cooling Technologies Inc., (ACT), NASA Marshall Space Flight Center, and the International Space Station office at NASA's Johnson Space Center demonstrated flight heritage in Low-Earth Orbit. The testing was conducted aboard the International Space Station (ISS) under the Advanced Passive Thermal eXperiment (APTx) project. The heat pipes were embedded in a high conductivity (HiK"TM") aluminum base plate and subject to a variety of thermal tests over a temperature range of -10 to 38 ºC for a ten-day period. Results showed excellent agreement with both predictions and ground tests. In addition, novel hybrid wick aluminum-ammonia heat pipes are developed to handle heat flux requirements for spacecraft thermal control applications. The 5-10 W/cm2 heat density limitation of aluminum-ammonia grooved heat pipes has been a fundamental limitation in the current design for space applications. The recently demonstrated 50 W/cm2 capability of the hybrid high heat flux heat pipes provides a realistic means of managing the high heat density anticipated for the next generation space designs.
Document ID
20180004476
Acquisition Source
Johnson Space Center
Document Type
Conference Paper
Authors
Ababneh, Mohammed T.
(Advanced Cooling Technologies, Inc. Lancaster, PA, United States)
Tarau, Calin
(Advanced Cooling Technologies, Inc. Lancaster, PA, United States)
Anderson, William G.
(Advanced Cooling Technologies, Inc. Lancaster, PA, United States)
Farmer, Jeffery T.
(NASA Marshall Space Flight Center Huntsville, AL, United States)
Hawkins, Robert F.
(NASA Marshall Space Flight Center Huntsville, AL, United States)
Alvarez-Hernandez, Angel R.
(NASA Johnson Space Center Houston, TX, United States)
Ortega, Stephania M.
(NASA Johnson Space Center Houston, TX, United States)
Fisher, Jesse W.
(Lockheed Martin Coherent Technologies Louisville, CO, United States)
Date Acquired
August 15, 2018
Publication Date
June 11, 2018
Subject Category
Engineering (General)
Report/Patent Number
JSC-E-DAA-TN54602
Meeting Information
Meeting: International Heat Pipe Symposium (IHPS)
Location: Pisa
Country: Italy
Start Date: June 10, 2018
End Date: June 14, 2018
Sponsors: Pisa Univ.
Funding Number(s)
CONTRACT_GRANT: NNX15CM03C
Distribution Limits
Public
Copyright
Public Use Permitted.
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