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Sixty Earth-Days Test of a Prototype Pt/HTCC Alumina Package in Simulated Venus EnvironmentThis paper presents experimental results of a prototype high temperature co-fired ceramic (HTCC) package with Au/Pt metallization in a three-phase harsh environment test that culminated with 60-day demonstration in simulated Venus surface environment of 465 degC with corrosive atmosphere at 90 bar pressure. The prototype package is based on previously developed and reported HTCC package successfully tested with multiple analog and digital silicon carbide (SiC) high temperatures semiconductor integrated circuits (ICs) at NASA Glenn Research Center in 500 degC Earth air ambient for over ten thousands hours, and short-term tested at temperatures above 800 degC. The three-phase harsh environment test started with 48 hours in 465 degC Earth air, followed by 48 hours in 465 degC nitrogen at 90 bar pressure and 1400 hours in simulated Venus surface environment of 465 degC with corrosive atmosphere at 90 bar. Initial analytical results of the package materials and surfaces after exposure to Venus environment are discussed to assess the stability of the packaging materials in the tested environments. The test in simulated Venus environment was implemented in the NASA Glenn Extreme Environment Rig (GEER). The results of this study suggest that an effective encapsulation of areas of surface metallization and vicinities may help to improve electrical performance of a HTCC alumina packaging system in Venus environment.
Document ID
20180006758
Acquisition Source
Glenn Research Center
Document Type
Conference Paper
Authors
Chen, Liangyu
(Ohio Aerospace Inst. Cleveland, OH, United States)
Neudeck, Philip G.
(NASA Glenn Research Center Cleveland, OH, United States)
Meredith, Roger D.
(NASA Glenn Research Center Cleveland, OH, United States)
Lukco, Dorothy
(Vantage Partners, LLC Brook Park, OH, United States)
Spry, David J.
(NASA Glenn Research Center Cleveland, OH, United States)
Nakley, Leah M.
(NASA Glenn Research Center Cleveland, OH, United States)
Phillips, Kyle G.
(HX5 Sierra, LLC Cleveland, OH, United States)
Beheim, Glenn M.
(NASA Glenn Research Center Cleveland, OH, United States)
Hunter, Gary W.
(NASA Glenn Research Center Cleveland, OH, United States)
Date Acquired
October 24, 2018
Publication Date
May 1, 2018
Subject Category
Lunar And Planetary Science And Exploration
Electronics And Electrical Engineering
Report/Patent Number
GRC-E-DAA-TN56139
Meeting Information
Meeting: iMAPS HiTEC 2018
Location: Albuquerque, NM
Country: United States
Start Date: May 8, 2018
End Date: May 10, 2018
Sponsors: International Microelectronics Assembly and Packaging Society (iMAPS)
Funding Number(s)
CONTRACT_GRANT: NNC13BA10B
WBS: WBS 811073.02.24.01.37
CONTRACT_GRANT: NNC15BA02B
Distribution Limits
Public
Copyright
Public Use Permitted.
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