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Temperature Mapping at the Thermal Barrier Coating/Bond Coat Interface by Luminescence Lifetime Imaging Using Integrated Erbium-Doped SublayersFull-field temperature mapping of thermal barrier coated components by either infrared thermography or phosphor thermometry has been limited to surface temperature mapping even though temperature mapping at the thermal barrier coating (TBC)/bond coat interface is more relevant for evaluating the TBC thermal protection performance. For the first time, 2D temperature mapping at the TBC/bond coat interface has now been achieved by full-field luminescence lifetime imaging measurements of emission from a thin erbium-doped yttria-stabilized zirconia (YSZ) sensing layer integrated into the TBC below the overlying undoped YSZ. This new capability was applied to map temperatures at the TBC/bond coat interface for TBC-coated specimens subjected to a heat flux produced by the NASA Glenn high heat flux laser facility. In particular, thermal gradients at the TBC/bond coat interface were mapped in regions where the TBC was subjected to erosion or to mechanically induced delamination crack propagation. Finally, temperature mapping of the TBC/bond coat interface was used to evaluate the effectiveness of surface air film cooling at the TBC/bond coat interface.
Document ID
20190025227
Document Type
Presentation
Authors
Eldridge, Jeffrey I.
(NASA Glenn Research Center Cleveland, OH, United States)
Wroblewski, Adam C.
(NASA Glenn Research Center Cleveland, OH, United States)
Wolfe, Douglas E.
(Pennsylvania State Univ. University Park, PA, United States)
Date Acquired
May 20, 2019
Publication Date
January 29, 2019
Subject Category
Solid-State Physics
Report/Patent Number
GRC-E-DAA-TN64850
Meeting Information
Meeting: International Conference on Advanced Ceramics & Composites
Location: Dayton Beach, FL
Country: United States
Start Date: January 27, 2019
End Date: February 1, 2019
Sponsors: The American Ceramic Society (ACerS)
Funding Number(s)
WBS: 109492.02.03.02.20.01
Distribution Limits
Public
Copyright
Public Use Permitted.
Technical Review
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