NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login
Back to Results
NASA Electronic Parts and Packaging (NEPP) Program Status and Technology Investments OverviewThe presentation provides an updated, high-level overview of the NEPP Program. The latest organizational chart is presented that shows the names of the Program and Assistant Program Managers. Additionally, the recent work that is on-going with the updating of several NASA NPDs, NPRs and technical standards is reviewed. Internal and external organizational interfaces are described. Finally, the current technology focus areas are described. These areas include passives, wide-band gap power devices, processor units (CPUs and GPUs), 2.5D and 3D device architectures, memories, and data analytics.
Document ID
20190026596
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Majewicz, Peter (NASA Goddard Space Flight Center Greenbelt, MD, United States)
Pellish, Jonathan (NASA Goddard Space Flight Center Greenbelt, MD, United States)
Sampson, Michael (NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
June 24, 2019
Publication Date
June 17, 2019
Subject Category
Electronics And Electrical Engineering
Administration And Management
Report/Patent Number
GSFC-E-DAA-TN70018
Meeting Information
Meeting: NASA Electronic Parts and Packaging (NEPP) Program 2019 Electronics Technology Workshop
Location: Greenbelt, MD
Country: United States
Start Date: June 17, 2019
End Date: June 20, 2019
Sponsors: NASA Goddard Space Flight Center
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Technical Review
Single Expert
Keywords
NEPAG
interfaces
NEPP

Related Records

There are no records associated with this record.
No Preview Available