Comparison of Design Tools for Stress Analysis of Adhesively Bonded Joints

Analytical or semi-analytical models for stress analysis have long been a part of initial adhesive bond design and sizing. Even with the rise of general finite element software and methods, these design models have still remained a preferred method for fast and simple joint analysis. While these methods can yield fairly representative results, the models are constructed on the foundation of geometrical and material simplifications or assumptions that allow closed form or semi-closed form solutions. This study outlines the major differences in basic assumptions for three common design software packages under use at NASA, and shows the ramifications these assumptions in a few exemplar bonded joints.