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Cracking Failures in Ceramic Capacitors and the Existing Screening and Qualification ProceduresThis presentation gives a review of recent project failures caused by cracks in ceramic capacitors and discusses deficiencies of the existing screening and qualification procedures that can reveal the propensity to cracking and effects of soldering stresses.
Document ID
20190028881
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Teverovsky, Alexander (Jacobs Engineering Group Baltimore, MD, United States)
Date Acquired
August 9, 2019
Publication Date
June 17, 2019
Subject Category
Structural Mechanics
Report/Patent Number
GSFC-E-DAA-TN69938
Report Number: GSFC-E-DAA-TN69938
Meeting Information
Meeting: NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop
Location: Greenbelt, MD
Country: United States
Start Date: June 17, 2019
End Date: June 20, 2019
Sponsors: NASA Goddard Space Flight Center
Funding Number(s)
CONTRACT_GRANT: 80GSFC18C0120
Distribution Limits
Public
Copyright
Public Use Permitted.
Technical Review
Single Expert
Keywords
ceramic capacitors
screening and qualification procedures

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