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Overview of Heatshield for Extreme Entry Environment Technology (HEEET)The objective of the Heatshield for Extreme Entry Environment Technology (HEEET) projects is to mature a 3-D Woven Thermal Protection System (TPS) to Technical Readiness Level (TRL) 6 to support future NASA missions to destinations such as Venus and Saturn. Destinations that have extreme entry environments with heat fluxes > 3500 W/sq cm and pressures up to 5 atmospheres, entry environments that NASA has not flown since Pioneer-Venus and Galileo. The scope of the project is broad and can be split into roughly four areas, Manufacturing/Integration, Structural Testing and Analysis, Thermal Testing and Analysis and Documentation. Manufacturing/Integration covers from raw materials, piece part fabrication to final integration on a 1-meter base diameter 45-degree sphere cone Engineering Test Unit (ETU). A key aspect of the project was to transfer as much of the manufacturing technology to industry in preparation to support future mission infusion. The forming, infusion and machining approaches were transferred to Fiber Materials Inc. and FMI then fabricated the piece parts from which the ETU was manufactured.
Document ID
20190031927
Acquisition Source
Ames Research Center
Document Type
Abstract
Authors
Driver, D. M.
(NASA Ames Research Center Moffett Field, CA, United States)
Ellerby, D. T.
(NASA Ames Research Center Moffett Field, CA, United States)
Gasch, M. J.
(NASA Ames Research Center Moffett Field, CA, United States)
Mahzari, M.
(NASA Ames Research Center Moffett Field, CA, United States)
Milos, F. S.
(NASA Ames Research Center Moffett Field, CA, United States)
Nishioka, O. S.
(NASA Ames Research Center Moffett Field, CA, United States)
Peterson, K. H.
(NASA Ames Research Center Moffett Field, CA, United States)
Stackpoole, M. M.
(NASA Ames Research Center Moffett Field, CA, United States)
Venkatapathy, E.
(NASA Ames Research Center Moffett Field, CA, United States)
Young, Z. W.
(NASA Ames Research Center Moffett Field, CA, United States)
Gage, P. J.
(Neerim Corp. Mountain View, CA, United States)
Boghozian, T.
(Analytical Mechanics Associates, Inc. Moffett Field, CA, United States)
Chavez-Garcia, J. F.
(Analytical Mechanics Associates, Inc. Moffett Field, CA, United States)
Gonzales, G. L.
(Analytical Mechanics Associates, Inc. Moffett Field, CA, United States)
Palmer, G. E.
(Analytical Mechanics Associates, Inc. Moffett Field, CA, United States)
Prabhu, D. K.
(Analytical Mechanics Associates, Inc. Moffett Field, CA, United States)
Williams, J. D.
(Analytical Mechanics Associates, Inc. Moffett Field, CA, United States)
Kazemba, C. D.
(Science and Technology Corp. Moffett Field, CA, United States)
Murphy, A. S.
(Millennium Engineering and Integration Co. Moffett Field, CA, United States)
Langston, S. L.
(Millennium Engineering and Integration Co. Moffett Field, CA, United States)
Poteet, C. C.
(NASA Langley Research Center Hampton, VA, United States)
Splinter, S. C.
(NASA Langley Research Center Hampton, VA, United States)
Fowler, M. E.
(NASA Johnson Space Center Houston, TX, United States)
Kellermann, C. M.
(Jacobs Engineering Group Houston, TX, United States)
Date Acquired
October 2, 2019
Publication Date
September 30, 2019
Subject Category
Spacecraft Design, Testing And Performance
Report/Patent Number
ARC-E-DAA-TN67635
Meeting Information
Meeting: International Conference on Flight Vehicles, Aerothermodynamics and Re-entry Missions & Engineering (FAR) 2019
Location: Monopoli
Country: Italy
Start Date: September 30, 2019
End Date: October 3, 2019
Sponsors: Centre National d'Etudes Spatiales (CNES), Agenzia Spaziale Italiana (ASI), NASA Headquarters
Distribution Limits
Public
Copyright
Public Use Permitted.
Keywords
Thermal Protection System
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