Effect of Phenolic Matrix Microcracking on the Structural Response of a 3-D Woven Thermal Protection System

The effect of microcracking in the phenolic matrix of a three-dimensional woven thermal protection system (TPS) and the resulting material stiffness reduction was studied via a comparison of finite element analysis results from a linear analysis and an iterative linear analysis. A TPS is necessary to protect space vehicles from the aerodynamic heating of planetary entry. The Heatshield for Extreme Entry Environment Technology (HEEET) project has developed a TPS for use in high heat-flux and pressure missions. The material is a dual-layer continuous dry weave, which is then infiltrated with a low-density phenolic resin matrix to form a rigid ablator. The phenolic resin matrix does not have structural load transfer requirements, and testing has shown that the phenolic resin can fully satisfy thermal requirements when the matrix contains microcracks. Due to high stresses in the through-the-thickness direction of the material, phenolic microcracks may form in the matrix material, which would result in a reduction of stiffness. An exploratory study was conducted to determine if reduction in material stiffness would change the load paths and/or decrease the structural margins. A comparison was performed between a linear finite element analysis that did not take into account phenolic microcracking and an iterative linear finite element analysis that accounted for propagation of phenolic microcracking. Four subcases using varying assumptions were analyzed and the results indicate that the assumed strength at which the phenolic microcracking propagates was the critical parameter for determining the extent of microcracking in the phenolic matrix. Phenolic microcracking does not have an adverse effect on the structural response of the test article and is not a critical failure.