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Lap Shear Testing of Candidate Radiator Panel AdhesivesDuring testing of a subscale radiator section used to develop manufacturing techniques for a full-scale radiator panel, the adhesive bonds between the titanium heat pipes and the aluminum face sheets failed during installation and operation. Analysis revealed that the thermal expansion mismatch between the two metals resulted in relatively large shear stresses being developed even when operating the radiator at moderate temperatures. Lap shear testing of the adhesive used in the original joints demonstrated that the two-part epoxy adhesive fell far short of the strength required. A literature review resulted in several candidate adhesives being selected for lap shear joint testing at room temperature and 398 K, the nominal radiator operating temperature. The results showed that two-part epoxies cured at room and elevated temperatures generally did not perform well. Epoxy film adhesives cured at elevated temperatures, on the other hand, did very well with most being sufficiently strong to cause yielding in the titanium sheet used for the joints. The use of an epoxy primer generally improved the strength of the joint. Based upon these results, a new adhesive was selected for the second subscale radiator section.
Document ID
20150007503
Acquisition Source
Glenn Research Center
Document Type
Conference Paper
Authors
Ellis, David
(NASA Glenn Research Center Cleveland, OH, United States)
Briggs, Maxwell
(NASA Glenn Research Center Cleveland, OH, United States)
McGowan, Randy
(Notre Dame Univ. IN, United States)
Date Acquired
May 6, 2015
Publication Date
February 25, 2013
Subject Category
Metals And Metallic Materials
Report/Patent Number
Paper 6829
E-664004
Meeting Information
Meeting: ANS Nuclear and Emerging Technologies for Space (NETS 2013) Topical Meeting
Location: Albuquerque, NM
Country: United States
Start Date: February 25, 2013
End Date: February 28, 2013
Funding Number(s)
WBS: WBS 138494.05.02.04.03
Distribution Limits
Public
Copyright
Public Use Permitted.
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