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The NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond and Recent Radiation HighlightsThis presentation is a NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond. This roadmap provides a snapshot for current plans and collaborations on testing and evaluation of electronics as well as a discussion of the technology selection approach.
Document ID
20150023279
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
LaBel, Kenneth A. (NASA Goddard Space Flight Center Greenbelt, MD United States)
Sampson, Michael J. (NASA Goddard Space Flight Center Greenbelt, MD United States)
Date Acquired
December 18, 2015
Publication Date
November 16, 2015
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
GSFC-E-DAA-TN27832
Meeting Information
Meeting: 2015 Radiation Hardened Electronics Technology (RHET)
Location: Albuquerque, NM
Country: United States
Start Date: November 16, 2015
End Date: November 18, 2015
Sponsors: Triad Semiconductor, Inc.
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Keywords
NASA Electronic Parts and Packaging (NEPP) Program
parts assurance
Technology Evaluation

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