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Laser Material Processing for Microengineering ApplicationsThe processing of materials via laser irradiation is presented in a brief survey. Various techniques currently used in laser processing are outlined and the significance to the development of space qualified microinstrumentation are identified. In general the laser processing technique permits the transferring of patterns (i.e. lithography), machining (i.e. with nanometer precision), material deposition (e.g., metals, dielectrics), the removal of contaminants/debris/passivation layers and the ability to provide process control through spectroscopy.
Document ID
19960054127
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Helvajian, H.
(Aerospace Corp. Los Angeles, CA United States)
Date Acquired
September 6, 2013
Publication Date
January 1, 1995
Subject Category
Lasers And Masers
Accession Number
96N36373
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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